Power/Performance Bits: Mar. 26
Material holds both electrons, holes Researchers at Ohio State University discovered a material that can hold both electrons and holes. They hope the material, the layered metal crystal NaSn2As2, could...
View ArticleSystem Bits: April 30
Future batteries could use a graphene sponge Researchers at Sweden’s Chalmers University of Technology devised a porous, sponge-like aerogel, made of reduced-graphene oxide, to serve as a freestanding...
View ArticlePower/Performance Bits: May 14
Detecting malware with power monitoring Engineers at the University of Texas at Austin and North Carolina State University devised a way to detect malware in large-scale embedded computer systems by...
View ArticleUnderstand MOSFET Switch Behavior Via An LED Driver Simulation
Automotive incandescent bulbs have largely given way to more efficient, reliable, stylish, and even safer light emitting diodes (LEDs). LEDs turn on in a fraction of the time and are especially useful...
View ArticlePower/Performance Bits: Aug. 10
Flexible electrodes for thin films Researchers from the University of Queensland and ARC Centre of Excellence in Exciton Science (University of Melbourne) developed a material for flexible, recyclable,...
View ArticlePower/Performance Bits: Oct. 6
Waste plastic supercapacitor Researchers from the University of California Riverside found a way to recycle waste plastic into energy storage devices. The work focused on polyethylene terephthalate...
View ArticlePower/Performance Bits: Oct. 12
More stable quantum states Researchers at the University of Chicago found a way to make quantum systems retain coherency 10,000 times longer. The fragile nature of quantum states remains a challenge...
View ArticleStartup Funding: October 2020
October 2020 was a big month for startups across the automotive space, with sizeable funding all around. Three startups based out of China brought in over $100M apiece for ADAS and autonomous driving,...
View Article200mm Demand Surges
A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a...
View ArticlePower/Performance Bits: Feb. 16
Superconducting microprocessor Researchers at Yokohama National University created a superconducting processor with zero electrical resistance. Huge amounts of power are being used by computers today,...
View ArticleThermal Floorplanning For Chips
Heat management is becoming crucial to an increasing number of chips, and it’s one of a growing number of interconnected factors that must be considered throughout the entire development flow. At the...
View Article3D Printing For More Circuits
After several years of experimentation, and growing success in volume manufacturing for some use cases, technologies for 3D printing of electronic circuits are becoming more common. Some innovations in...
View ArticlePower/Performance Bits: Feb. 15
3D printed piezoelectrics Researchers at University of Notre Dame and Purdue University developed a hybrid 3D printer that combines multi-material aerosol jet printing and extrusion printing,...
View ArticleGaN ICs Wanted for Power, EV Markets
Circuits built with discrete GaN components may get the job done, but fully integrated GaN circuits remain the ultimate goal because they would offer many of the same advantages as integrated silicon...
View ArticleMicroLEDs Move Toward Commercialization
The market for MicroLED displays is heating up, fueled by a raft of innovations in design and manufacturing that can increase yield and reduce prices, making them competitive with LCD and OLED devices....
View ArticleResearch Bits: March 14
Shift register-in-memory architecture Researchers at the Singapore University of Technology and Design propose a new reconfigurable shift register-in-memory architecture for devices that can work both...
View ArticleResearch Bits: September 11
Combining digital and analog Researchers from École Polytechnique Fédérale de Lausanne (EPFL) propose integrating 2D semiconductors with ferroelectric materials for joint digital and analog information...
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